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title: S4; enable IO devices for r8a779f0
team: IO
key: 96783090-d6a7-11ec-857c-172fbeb15dc7
assignee: Wolfram
status: Active
upstream:
- lore: 20220610201701.7946-1-wsa+renesas@sang-engineering.com # [PATCH v3 1/2] dt-bindings: thermal: rcar-gen3-thermal: use positive logic
- lore: 20220610201701.7946-2-wsa+renesas@sang-engineering.com # [PATCH v3 2/2] dt-bindings: thermal: rcar-gen3-thermal: Add r8a779f0 support
- lore: 20220525151130.24103-1-wsa+renesas@sang-engineering.com # [PATCH] clk: renesas: r8a779f0: Add thermal clock
- lore: 20220525151216.24133-1-wsa+renesas@sang-engineering.com # [PATCH 1/2] thermal: rcar_gen3_thermal: Add r8a779f0 support
- lore: 20220610200500.6727-1-wsa+renesas@sang-engineering.com # [PATCH v3] thermal: rcar_gen3_thermal: improve logging during probe
- lore: 20220525151355.24175-1-wsa+renesas@sang-engineering.com # [PATCH] arm64: dts: renesas: r8a779f0: Add thermal support
- next: 94fbac6ee3af75f8418d92af0e363b41eaf91b08 # mmc: renesas_sdhi: add R-Car Gen4 fallback compatibility string
- next: 6aa26be14d2a099d4b17a06b33ca9a6996a242d0 # dt-bindings: mmc: renesas,sdhi: Document R-Car S4-8 and generic Gen4 support
- lore: 20220603233437.21819-1-wsa+renesas@sang-engineering.com # [PATCH] clk: renesas: r8a779f0: Add SDHI0 clock
- lore: 20220603233928.22004-1-wsa+renesas@sang-engineering.com # [PATCH] arm64: dts: renesas: r8a779f0: Add SDHI0 support
- lore: 20220608094831.8242-1-wsa+renesas@sang-engineering.com # [PATCH] dt-bindings: mmc: renesas,sdhi: R-Car V3U is R-Car Gen4
- lore: 20220608122344.3431-1-wsa+renesas@sang-engineering.com # [PATCH] dt-bindings: mmc: renesas,sdhi: Add R-Car Gen4 clock requirements
comments:
- CMT0/1
- HSCIF
- HSCIF 0+1 can be muxed to FTDI chips, HSCIF3 to MSIOF headers using an external FTDI, HSCIF2 maybe via unpopulated I2C header
- MSIOF
- RPC
- not for upstream because RPC shall only be accessed via OPTEE. See BSP commit 1f83a133b853138fad712d0a08a7689aac1e0183 ("Disable SPI flash via RPC")
- SCIF
- SCIF 0+3 can be muxed to FTDI chips, SCIF1 to MSIOF headers using an external FTDI, SCIF4 maybe via unpopulated I2C header
- SD/MMC
- eMMC enabled and works, microSD enabled but still needs testing
- first patches sent, only final DTS addition kept until testing is done
- SD0H support was missing, resend needed
- THS/CIVM
- first version sent
- patch to improve logging needed more versions but we now came to a conclusion
- binding documentation needed more versions to handle the differences between all SoCs
- TMU
- probably possible; pinmux to TCLK1-4 and check via non-populated I2C header on breakout board
- all other devices are in the control domain which we do not handle. Only the application domain is our job.
- for a domain overview, check '001_R-CarS4_Bus Architecture_Rev0p70.pptx' (attachment in the S4 docs)
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