title: S4; enable IO devices for r8a779f0
team: IO
key: 96783090-d6a7-11ec-857c-172fbeb15dc7
assignee: Wolfram
status: Active

upstream:
 - lore: 20220610201701.7946-1-wsa+renesas@sang-engineering.com # [PATCH v3 1/2] dt-bindings: thermal: rcar-gen3-thermal: use positive logic
 - lore: 20220610201701.7946-2-wsa+renesas@sang-engineering.com # [PATCH v3 2/2] dt-bindings: thermal: rcar-gen3-thermal: Add r8a779f0 support
 - lore: 20220525151130.24103-1-wsa+renesas@sang-engineering.com # [PATCH] clk: renesas: r8a779f0: Add thermal clock
 - lore: 20220525151216.24133-1-wsa+renesas@sang-engineering.com # [PATCH 1/2] thermal: rcar_gen3_thermal: Add r8a779f0 support
 - lore: 20220610200500.6727-1-wsa+renesas@sang-engineering.com # [PATCH v3] thermal: rcar_gen3_thermal: improve logging during probe
 - lore: 20220525151355.24175-1-wsa+renesas@sang-engineering.com # [PATCH] arm64: dts: renesas: r8a779f0: Add thermal support

 - next: 94fbac6ee3af75f8418d92af0e363b41eaf91b08 # mmc: renesas_sdhi: add R-Car Gen4 fallback compatibility string
 - next: 6aa26be14d2a099d4b17a06b33ca9a6996a242d0 # dt-bindings: mmc: renesas,sdhi: Document R-Car S4-8 and generic Gen4 support
 - lore: 20220603233437.21819-1-wsa+renesas@sang-engineering.com # [PATCH] clk: renesas: r8a779f0: Add SDHI0 clock
 - lore: 20220603233928.22004-1-wsa+renesas@sang-engineering.com # [PATCH] arm64: dts: renesas: r8a779f0: Add SDHI0 support
 - lore: 20220608094831.8242-1-wsa+renesas@sang-engineering.com # [PATCH] dt-bindings: mmc: renesas,sdhi: R-Car V3U is R-Car Gen4
 - lore: 20220608122344.3431-1-wsa+renesas@sang-engineering.com # [PATCH] dt-bindings: mmc: renesas,sdhi: Add R-Car Gen4 clock requirements


comments:
 - CMT0/1

 - HSCIF
  - HSCIF 0+1 can be muxed to FTDI chips, HSCIF3 to MSIOF headers using an external FTDI, HSCIF2 maybe via unpopulated I2C header

 - MSIOF

 - RPC
  - not for upstream because RPC shall only be accessed via OPTEE. See BSP commit 1f83a133b853138fad712d0a08a7689aac1e0183 ("Disable SPI flash via RPC")

 - SCIF
  - SCIF 0+3 can be muxed to FTDI chips, SCIF1 to MSIOF headers using an external FTDI, SCIF4 maybe via unpopulated I2C header

 - SD/MMC
  - eMMC enabled and works, microSD enabled but still needs testing
  - first patches sent, only final DTS addition kept until testing is done
  - SD0H support was missing, resend needed

 - THS/CIVM
  - first version sent
  - patch to improve logging needed more versions but we now came to a conclusion
  - binding documentation needed more versions to handle the differences between all SoCs

 - TMU
  - probably possible; pinmux to TCLK1-4 and check via non-populated I2C header on breakout board

 - all other devices are in the control domain which we do not handle. Only the application domain is our job.
  - for a domain overview, check '001_R-CarS4_Bus Architecture_Rev0p70.pptx' (attachment in the S4 docs)